Three-point bending fatigue behaviour of DIW-printed microporous titanium filaments for orthopaedic lattices
Loading...
Date
Advisor
Referee
Mark
Journal Title
Journal ISSN
Volume Title
Publisher
Elsevier
Altmetrics
Abstract
This study reports fatigue data on microporous titanium (Ti) filaments fabricated by direct ink writing (DIW) for orthopaedic applications. Compact (6% closed-pore-dominated) and porous (15% open-pore-dominated) variants were tested under three-point bending fatigue. Fractography and elastoplastic finite element analysis (FEA) were used to relate surface roughness and microporosity to crack path and local surface stress–strain fields. FEA showed equivalent plastic strain concentrated at surface valleys, with maximum values up to 50% higher in porous than in compact filaments, consistent with earlier fatigue crack initiation. Fractography revealed pronounced crack deflection and branching in the porous filaments, induced by an interconnected micropore network, increasing crack-path tortuosity and thereby slowing long-crack (Stage II) propagation. Consequently, porous filaments tended to show higher low-cycle fatigue resistance, whereas high-cycle fatigue lives were comparable between the two filament variants. These filament-scale findings complement lattice-scale observations in which porous lattices exhibit superior overall fatigue resistance, reflecting the dominance of long-crack propagation at that scale. The results highlight the promise of DIW Ti with tailored open microporosity for load-bearing implants.
Description
Keywords
Citation
Materials & Design. 2026, vol. 264, issue April, p. 1-9.
https://www.sciencedirect.com/science/article/pii/S0264127526002728
https://www.sciencedirect.com/science/article/pii/S0264127526002728
Document type
Peer-reviewed
Document version
Published version
Date of access to the full text
Language of document
en
Study field
Comittee
Date of acceptance
Defence
Result of defence
Endorsement
Review
Supplemented By
Referenced By
Creative Commons license
Except where otherwised noted, this item's license is described as Creative Commons Attribution 4.0 International

0000-0001-8847-075X 