The Analysis of Solder Preforms in Surface Mount Assembly

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but.event.date28.04.2016cs
but.event.titleStudent EEICT 2016cs
dc.contributor.authorNovotný, Václav
dc.contributor.authorVala, Radek
dc.date.accessioned2018-07-10T12:48:21Z
dc.date.available2018-07-10T12:48:21Z
dc.date.issued2016cs
dc.description.abstractThis article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types of solder preforms, their application and different methods of using in surface mount assembly. Text further comprises comparison of the solder joint which is manufactured by printing of solder paste through the cooper stencil and solder joint manufactured by applying of solder preform. The results of these basic processes are compared with method of solder fortification. In conclusion, there are evaluated outputs from experimental manufactory of solder joints with solder preforms and complemented by outputs which are achieved by x-ray machine.en
dc.formattextcs
dc.format.extent685-689cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationProceedings of the 22nd Conference STUDENT EEICT 2016. s. 685-689. ISBN 978-80-214-5350-0cs
dc.identifier.isbn978-80-214-5350-0
dc.identifier.urihttp://hdl.handle.net/11012/84020
dc.language.isoencs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 22nd Conference STUDENT EEICT 2016en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.rights.accessopenAccessen
dc.subjectSolderen
dc.subjectPreformsen
dc.subjectReliabilityen
dc.subjectFortificationen
dc.subjectWettabilityen
dc.titleThe Analysis of Solder Preforms in Surface Mount Assemblyen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
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