The Analysis of Solder Preforms in Surface Mount Assembly
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Date
2016
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Mark
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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
This article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types of solder preforms, their application and different methods of using in surface mount assembly. Text further comprises comparison of the solder joint which is manufactured by printing of solder paste through the cooper stencil and solder joint manufactured by applying of solder preform. The results of these basic processes are compared with method of solder fortification. In conclusion, there are evaluated outputs from experimental manufactory of solder joints with solder preforms and complemented by outputs which are achieved by x-ray machine.
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Citation
Proceedings of the 22nd Conference STUDENT EEICT 2016. s. 685-689. ISBN 978-80-214-5350-0
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
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Peer-reviewed
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en
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© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií