Sensitive Analysis of IR Heat Emitter for Soldering

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but.event.date28.04.2016cs
but.event.titleStudent EEICT 2016cs
dc.contributor.authorSkácel, Josef
dc.contributor.authorOtáhal, Alexandr
dc.date.accessioned2018-07-10T12:48:21Z
dc.date.available2018-07-10T12:48:21Z
dc.date.issued2016cs
dc.description.abstractThis paper deals with the possibility of simulation in ANSYS. Research is focused on the sensitive analysis of heat emitters. The first part is about basic properties of infrared heat emitter. For soldering is necessary to use heat emitter with the homogenous thermal field. In this case was used two types of wire arrangement. Classics spiral and type with two winding for the better homogenous thermal field. Next part deals with steady-state thermal simulation and transient simulation of heat emitter in ANSYS Workbench.en
dc.formattextcs
dc.format.extent655-659cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationProceedings of the 22nd Conference STUDENT EEICT 2016. s. 655-659. ISBN 978-80-214-5350-0cs
dc.identifier.isbn978-80-214-5350-0
dc.identifier.urihttp://hdl.handle.net/11012/84014
dc.language.isoencs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 22nd Conference STUDENT EEICT 2016en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.rights.accessopenAccessen
dc.subjectANSYSen
dc.subjectheat emitteren
dc.subjectsensitive analysisen
dc.subjectreflowen
dc.titleSensitive Analysis of IR Heat Emitter for Solderingen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
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