Sensitive Analysis of IR Heat Emitter for Soldering
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Date
Authors
Skácel, Josef
Otáhal, Alexandr
Advisor
Referee
Mark
Journal Title
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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
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Abstract
This paper deals with the possibility of simulation in ANSYS. Research is focused on the sensitive analysis of heat emitters. The first part is about basic properties of infrared heat emitter. For soldering is necessary to use heat emitter with the homogenous thermal field. In this case was used two types of wire arrangement. Classics spiral and type with two winding for the better homogenous thermal field. Next part deals with steady-state thermal simulation and transient simulation of heat emitter in ANSYS Workbench.
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Citation
Proceedings of the 22nd Conference STUDENT EEICT 2016. s. 655-659. ISBN 978-80-214-5350-0
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
Document type
Peer-reviewed
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Published version
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en