Analysis of Application Flux and Solder Paste on PCB for BGA Components

but.event.date	28.04.2016	cs
but.event.title	Student EEICT 2016	cs
dc.contributor.author	Toufar, Michal
dc.date.accessioned	2018-07-10T12:48:14Z
dc.date.available	2018-07-10T12:48:14Z
dc.date.issued	2016	cs
dc.description.abstract	This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.	en
dc.format	text	cs
dc.format.extent	203-205	cs
dc.format.mimetype	application/pdf	en
dc.identifier.citation	Proceedings of the 22nd Conference STUDENT EEICT 2016. s. 203-205. ISBN 978-80-214-5350-0	cs
dc.identifier.isbn	978-80-214-5350-0
dc.identifier.uri	http://hdl.handle.net/11012/83917
dc.language.iso	cs	cs
dc.publisher	Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií	cs
dc.relation.ispartof	Proceedings of the 22nd Conference STUDENT EEICT 2016	en
dc.relation.uri	http://www.feec.vutbr.cz/EEICT/	cs
dc.rights	© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií	cs
dc.rights.access	openAccess	en
dc.subject	BGA	en
dc.subject	flux	en
dc.subject	solder	en
dc.subject	repair	en
dc.title	Analysis of Application Flux and Solder Paste on PCB for BGA Components	en
dc.type.driver	conferenceObject	en
dc.type.status	Peer-reviewed	en
dc.type.version	publishedVersion	en
eprints.affiliatedInstitution.department	Fakulta elektrotechniky a komunikačních technologií	cs

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