Analysis of Application Flux and Solder Paste on PCB for BGA Components
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Date
Authors
Toufar, Michal
Advisor
Referee
Mark
Journal Title
Journal ISSN
Volume Title
Publisher
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
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Abstract
This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.
Description
Citation
Proceedings of the 22nd Conference STUDENT EEICT 2016. s. 203-205. ISBN 978-80-214-5350-0
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
Document type
Peer-reviewed
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Published version
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cs