Circuits for the Charge Push-through Electronics: Power Efficient Signal Processing Inside the Artificial Cochlear Implant

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dc.contributor.authorŽák, Jaromírcs
dc.contributor.authorHubálek, Jaromírcs
dc.contributor.authorPrášek, Jancs
dc.contributor.authorPekárek, Jancs
dc.contributor.authorSvatoš, Vojtěchcs
dc.contributor.authorHadaš, Zdeněkcs
dc.contributor.authorDušek, Danielcs
dc.coverage.issue1cs
dc.coverage.volume168cs
dc.date.issued2016-09-04cs
dc.description.abstractThis work deals with the new technique called Charge Push-Through technology which is more energy efficient than the currently used approaches. The new energy efficient design regarding utilization of emerging technology such as Energy harvesting (EH) power sources is very promising for future development of energy independent (zero-power) and nonobtrusive cochlear implant. This work presents the solution of Charge Push-Through circuits using the component level design of artificial cochlea.en
dc.description.abstractThis work deals with the new technique called Charge Push-Through technology which is more energy efficient than the currently used approaches. The new energy efficient design regarding utilization of emerging technology such as Energy harvesting (EH) power sources is very promising for future development of energy independent (zero-power) and nonobtrusive cochlear implant. This work presents the solution of Charge Push-Through circuits using the component level design of artificial cochlea.en
dc.formattextcs
dc.format.extent1710-1713cs
dc.format.mimetypeapplication/pdfcs
dc.identifier.citationProcedia Engineering. 2016, vol. 168, issue 1, p. 1710-1713.en
dc.identifier.doi10.1016/j.proeng.2016.11.496cs
dc.identifier.issn1877-7058cs
dc.identifier.orcid0000-0002-7496-2558cs
dc.identifier.orcid0000-0003-1228-5712cs
dc.identifier.orcid0000-0002-9857-1981cs
dc.identifier.orcid0000-0002-9097-1550cs
dc.identifier.other131436cs
dc.identifier.researcheridD-7753-2012cs
dc.identifier.researcheridE-2387-2012cs
dc.identifier.researcheridD-7620-2012cs
dc.identifier.researcheridI-4299-2014cs
dc.identifier.scopus57207501711cs
dc.identifier.scopus7003947942cs
dc.identifier.scopus35173314700cs
dc.identifier.scopus24767676300cs
dc.identifier.urihttp://hdl.handle.net/11012/204223
dc.language.isoencs
dc.publisherElseviercs
dc.relation.ispartofProcedia Engineeringcs
dc.relation.urihttps://www.sciencedirect.com/science/article/pii/S1877705816338188cs
dc.rightsCreative Commons Attribution-NonCommercial-NoDerivatives 4.0 Internationalcs
dc.rights.accessopenAccesscs
dc.rights.sherpahttp://www.sherpa.ac.uk/romeo/issn/1877-7058/cs
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/cs
dc.subjectArtificial cochleaen
dc.subjectcharge push throughen
dc.subjectzero power systemen
dc.subjectArtificial cochlea
dc.subjectcharge push through
dc.subjectzero power system
dc.titleCircuits for the Charge Push-through Electronics: Power Efficient Signal Processing Inside the Artificial Cochlear Implanten
dc.title.alternativeCircuits for the Charge Push-through Electronics: Power Efficient Signal Processing Inside the Artificial Cochlear Implanten
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
sync.item.dbidVAV-131436en
sync.item.dbtypeVAVen
sync.item.insts2025.10.14 14:08:23en
sync.item.modts2025.10.14 10:49:34en
thesis.grantorVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií. Ústav mikroelektronikycs
thesis.grantorVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií. oddělení-MEL-SIXcs

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