Modeling the Substrate Skin Effects in Mutual RL Characteristics.,

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dc.contributor.authorYmeri, Hasan
dc.contributor.authorNauwelaers, B.
dc.contributor.authorMaex, Karen
dc.contributor.authorde Roest, D.
dc.coverage.issue4cs
dc.coverage.volume12cs
dc.date.accessioned2016-04-28T06:19:08Z
dc.date.available2016-04-28T06:19:08Z
dc.date.issued2003-12cs
dc.description.abstractThe goal of this work was to model the influence of the substrate skin effects on the distributed mutual impedance per unit length parameters of multiple coupled on-chip interconnects. The proposed analytic model is based on the frequency-dependent distribution of the current in the silicon substrate and the closed form integration approach. It is shown that the calculated frequency-dependent distributed mutual inductance and the associated mutual resistance are in good agreement with the results obtained from CAD-oriented circuit modeling technique.en
dc.formattextcs
dc.format.extent21-25cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationRadioengineering. 2003, vol. 12, č. 4, s. 21-25. ISSN 1210-2512cs
dc.identifier.issn1210-2512
dc.identifier.urihttp://hdl.handle.net/11012/58115
dc.language.isoencs
dc.publisherSpolečnost pro radioelektronické inženýrstvícs
dc.relation.ispartofRadioengineeringcs
dc.relation.urihttp://www.radioeng.cz/fulltexts/2003/03_04_21_25.pdfcs
dc.rightsCreative Commons Attribution 3.0 Unported Licenseen
dc.rights.accessopenAccessen
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/en
dc.subjectMATLABen
dc.subjectalgorithmsen
dc.subjectimage compressionen
dc.subject2D DCTen
dc.subjectNRMSEen
dc.subjectcalculation timeen
dc.titleModeling the Substrate Skin Effects in Mutual RL Characteristics.,en
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.facultyFakulta eletrotechniky a komunikačních technologiícs
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