Modeling the Substrate Skin Effects in Mutual RL Characteristics.,

Abstract

The goal of this work was to model the influence of the substrate skin effects on the distributed mutual impedance per unit length parameters of multiple coupled on-chip interconnects. The proposed analytic model is based on the frequency-dependent distribution of the current in the silicon substrate and the closed form integration approach. It is shown that the calculated frequency-dependent distributed mutual inductance and the associated mutual resistance are in good agreement with the results obtained from CAD-oriented circuit modeling technique.