Enhanced Coupling Values in Coupled Microstrip Lines using Metamaterials
Loading...
Date
2008-06
Authors
Lauro, Sebastian E.
Toscano, Alessandro
Vegni, Lucio
ORCID
Advisor
Referee
Mark
Journal Title
Journal ISSN
Volume Title
Publisher
Společnost pro radioelektronické inženýrství
Abstract
In this paper, we show how metamaterials can be used to enhance the coupling values of microstrip directional couplers. Coupling between regular coplanar microstrip lines, in fact, is limited, due to the small ratios between the characteristic impedances of even and odd TEM modes supported by the structure. The broadside configuration or the employment of an overlay are often utilized to overcome this limitation, leading, however, to more bulky components. On the other hand, the employment of metamaterials with a negative real part of the permittivity is able to increase the coupling values, while keeping the profile of the structure very low. A quasi-static model of the structure is developed and physical insights on the operation of the proposed component and on the role of the metamaterial loading are also given. Simple design formulae derived through a conformal mapping technique are presented and validated through proper full wave numerical simulations.
Description
Keywords
Citation
Radioengineering. 2008, vol. 17, č. 2, s. 56-60. ISSN 1210-2512
http://www.radioeng.cz/fulltexts/2008/08_02_056_060.pdf
http://www.radioeng.cz/fulltexts/2008/08_02_056_060.pdf
Document type
Peer-reviewed
Document version
Published version
Date of access to the full text
Language of document
en