Analysis of Defects on PCB Using X-RAY, 3D SW CERA and Micro-Sections

Abstract

This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg.: modern X-ray defect detection.