Analysis of Defects on PCB Using X-RAY, 3D SW CERA and Micro-Sections
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Date
2016
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Mark
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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg.: modern X-ray defect detection.
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Proceedings of the 22nd Conference STUDENT EEICT 2016. s. 206-208. ISBN 978-80-214-5350-0
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
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Peer-reviewed
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cs
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Defence
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© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií