Calculation and Measurement of Thermostatic Bimetal Deflection in Molded Case Circuit Breaker

but.event.date28.04.2016cs
but.event.titleStudent EEICT 2016cs
dc.contributor.authorZelenka, Michal
dc.date.accessioned2018-07-10T12:48:18Z
dc.date.available2018-07-10T12:48:18Z
dc.date.issued2016cs
dc.description.abstractThis paper deals with a thermal overload trip unit in automatically operated electrical switching devices. The first part describes an application of thermostatic bimetal in thermal overload trip unit. The main part is devoted to analytical calculation and measurement of specific thermostatic bimetal type contained in thermal trip unit of molded case circuit breaker. It is measurement of deflection depending on temperature change using photoelectric laser sensor. The analytical results are compared with the measured results at the end of the paper.en
dc.formattextcs
dc.format.extent467-471cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationProceedings of the 22nd Conference STUDENT EEICT 2016. s. 467-471. ISBN 978-80-214-5350-0cs
dc.identifier.isbn978-80-214-5350-0
dc.identifier.urihttp://hdl.handle.net/11012/83977
dc.language.isoencs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 22nd Conference STUDENT EEICT 2016en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.rights.accessopenAccessen
dc.subjectthermostatic bimetalen
dc.subjectmolded case circuit breakeren
dc.subjectmeasurementen
dc.titleCalculation and Measurement of Thermostatic Bimetal Deflection in Molded Case Circuit Breakeren
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
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