Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

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dc.contributor.authorNabi, Shabanovcs
dc.contributor.authorRabadanov, Kamilcs
dc.contributor.authorSuleimanov, Sagimcs
dc.contributor.authorAmirov, Akhmedcs
dc.contributor.authorIsaev, Abdulgalimcs
dc.contributor.authorSobola, Dinaracs
dc.contributor.authorMurliev, Eldarcs
dc.contributor.authorAsvarova, Gulnaracs
dc.coverage.issue9cs
dc.coverage.volume14cs
dc.date.issued2021-04-26cs
dc.description.abstractThe aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.en
dc.formattextcs
dc.format.extent1-12cs
dc.format.mimetypeapplication/pdfcs
dc.identifier.citationMaterials . 2021, vol. 14, issue 9, p. 1-12.en
dc.identifier.doi10.3390/ma14092218cs
dc.identifier.issn1996-1944cs
dc.identifier.orcid0000-0002-0008-5265cs
dc.identifier.other171356cs
dc.identifier.researcheridG-1175-2019cs
dc.identifier.scopus57189064262cs
dc.identifier.urihttp://hdl.handle.net/11012/203234
dc.language.isoencs
dc.publisherMDPIcs
dc.relation.ispartofMaterialscs
dc.relation.urihttps://www.mdpi.com/1996-1944/14/9/2218/htmcs
dc.rightsCreative Commons Attribution 4.0 Internationalcs
dc.rights.accessopenAccesscs
dc.rights.sherpahttp://www.sherpa.ac.uk/romeo/issn/1996-1944/cs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjectorganometallic compounden
dc.subjectconductivityen
dc.subjectthermogravimetryen
dc.titleWater-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Componentsen
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
sync.item.dbidVAV-171356en
sync.item.dbtypeVAVen
sync.item.insts2025.02.03 15:40:29en
sync.item.modts2025.01.17 15:27:30en
thesis.grantorVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií. Ústav fyzikycs
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