Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components
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Date
2021-04-26
Authors
Nabi, Shabanov
Rabadanov, Kamil
Suleimanov, Sagim
Amirov, Akhmed
Isaev, Abdulgalim
Sobola, Dinara
Murliev, Eldar
Asvarova, Gulnara
ORCID
0000-0002-0008-5265Advisor
Referee
Mark
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Publisher
MDPI
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Abstract
The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.
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Peer-reviewed
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en