Technological aspects of rework
| but.event.date | 23.04.2015 | cs |
| but.event.title | Student EEICT 2015 | cs |
| dc.contributor.author | Řihák, P. | |
| dc.date.accessioned | 2015-08-25T08:43:03Z | |
| dc.date.available | 2015-08-25T08:43:03Z | |
| dc.date.issued | 2015 | cs |
| dc.description.abstract | The paper deals with the technological aspects of rework. There are introduced some of these aspects as ambient temperature and ambient humidity, handling and storing devices and components, operators work, reflow soldering thermal profile, influence of flux. Technological aspects negatively influence reliability of soldering process, it is important to pay close attention to this phenomenon. They also have negative influence on repair yield. | en |
| dc.format | text | cs |
| dc.format.extent | 396-400 | cs |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | Proceedings of the 21st Conference STUDENT EEICT 2015. s. 396-400. ISBN 978-80-214-5148-3 | cs |
| dc.identifier.isbn | 978-80-214-5148-3 | |
| dc.identifier.uri | http://hdl.handle.net/11012/43031 | |
| dc.language.iso | en | cs |
| dc.publisher | Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií | cs |
| dc.relation.ispartof | Proceedings of the 21st Conference STUDENT EEICT 2015 | en |
| dc.relation.uri | http://www.feec.vutbr.cz/EEICT/ | cs |
| dc.rights | © Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií | cs |
| dc.rights.access | openAccess | en |
| dc.title | Technological aspects of rework | en |
| dc.type.driver | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
| eprints.affiliatedInstitution.department | Fakulta elektrotechniky a komunikačních technologií | cs |