Technological aspects of rework
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Date
Authors
Řihák, P.
Advisor
Referee
Mark
Journal Title
Journal ISSN
Volume Title
Publisher
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
ORCID
Abstract
The paper deals with the technological aspects of rework. There are introduced some of these aspects as ambient temperature and ambient humidity, handling and storing devices and components, operators work, reflow soldering thermal profile, influence of flux. Technological aspects negatively influence reliability of soldering process, it is important to pay close attention to this phenomenon. They also have negative influence on repair yield.
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Citation
Proceedings of the 21st Conference STUDENT EEICT 2015. s. 396-400. ISBN 978-80-214-5148-3
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
Document type
Peer-reviewed
Document version
Published version
Date of access to the full text
Language of document
en
