Package and PCB Effects Shift Intermodulation Notch in an RF Common-Emitter Amplifier
| dc.contributor.author | Wu, Jian-Ming | |
| dc.contributor.author | Ko, Ming-Yin | |
| dc.coverage.issue | 1 | cs |
| dc.coverage.volume | 23 | cs |
| dc.date.accessioned | 2014-12-09T11:40:22Z | |
| dc.date.available | 2014-12-09T11:40:22Z | |
| dc.date.issued | 2014-04 | cs |
| dc.description.abstract | A Taylor series analysis is conducted to study the effects of the package and printed circuit board (PCB) on the intermodulation nulling of an RF common-emitter amplifier. The equivalent parasitic element of the package and PCB interconnects is extracted from the impedance and admittance parameters, which are obtained using a three-dimensional (3-D) electromagnetic simulation tool. The theoretical analysis reveals that the effects of the package and PCB on the intermodulation nulling of common-emitter amplifiers is to shift the intermodulation notch; that the third-order intermodulation (IM3) products under an original bias condition cannot be suppressed and that the linearity of common-emitter amplifiers is thereby degraded. A comparison between theory and simulation reveals good agreement in the predicted locations of the intermodulation notch in the absence and presence of a package and PCB. | en |
| dc.format | text | cs |
| dc.format.extent | 229-235 | cs |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | Radioengineering. 2014, vol. 23, č. 1, s. 229-235. ISSN 1210-2512 | cs |
| dc.identifier.issn | 1210-2512 | |
| dc.identifier.uri | http://hdl.handle.net/11012/36413 | |
| dc.language.iso | en | cs |
| dc.publisher | Společnost pro radioelektronické inženýrství | cs |
| dc.relation.ispartof | Radioengineering | cs |
| dc.relation.uri | http://www.radioeng.cz/fulltexts/2014/14_01_0229_0235.pdf | cs |
| dc.rights | Creative Commons Attribution 3.0 Unported License | en |
| dc.rights.access | openAccess | en |
| dc.rights.uri | http://creativecommons.org/licenses/by/3.0/ | en |
| dc.subject | Package and printed circuit board (PCB) effects | en |
| dc.subject | intermodulation nulling | en |
| dc.subject | common-emitter amplifier | en |
| dc.subject | Taylor series | en |
| dc.title | Package and PCB Effects Shift Intermodulation Notch in an RF Common-Emitter Amplifier | en |
| dc.type.driver | article | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
| eprints.affiliatedInstitution.faculty | Fakulta eletrotechniky a komunikačních technologií | cs |