Development in Electronic Packaging – Moving to 3D System Configuration
| dc.contributor.author | Szendiuch, I. | |
| dc.coverage.issue | 1 | cs |
| dc.coverage.volume | 20 | cs |
| dc.date.accessioned | 2016-02-26T08:17:27Z | |
| dc.date.available | 2016-02-26T08:17:27Z | |
| dc.date.issued | 2011-04 | cs |
| dc.description.abstract | The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the required function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight is being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now feature limits for further integration. System on Package (SOP) is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concepts are “Package on Package” (PoP) or ”Package in Package” (PiP). | en |
| dc.format | text | cs |
| dc.format.extent | 214-220 | cs |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | Radioengineering. 2011, vol. 20, č. 1, s. 214-220. ISSN 1210-2512 | cs |
| dc.identifier.issn | 1210-2512 | |
| dc.identifier.uri | http://hdl.handle.net/11012/56821 | |
| dc.language.iso | en | cs |
| dc.publisher | Společnost pro radioelektronické inženýrství | cs |
| dc.relation.ispartof | Radioengineering | cs |
| dc.relation.uri | http://www.radioeng.cz/fulltexts/2011/11_01_214_220.pdf | cs |
| dc.rights | Creative Commons Attribution 3.0 Unported License | en |
| dc.rights.access | openAccess | en |
| dc.rights.uri | http://creativecommons.org/licenses/by/3.0/ | en |
| dc.subject | Electronic Packaging | en |
| dc.subject | Integration in Electronics | en |
| dc.subject | System on Package (SoP) | en |
| dc.subject | Package on Package (PoP) | en |
| dc.subject | 3D packaging | en |
| dc.title | Development in Electronic Packaging – Moving to 3D System Configuration | en |
| dc.type.driver | article | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
| eprints.affiliatedInstitution.faculty | Fakulta eletrotechniky a komunikačních technologií | cs |
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