Streamlining the Process of Cleaning PCB after Removing BGA
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Date
2016
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Mark
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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.
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Citation
Proceedings of the 22nd Conference STUDENT EEICT 2016. s. 237-239. ISBN 978-80-214-5350-0
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
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Peer-reviewed
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sk
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© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií