Streamlining the Process of Cleaning PCB after Removing BGA
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Date
Authors
Starčok, Tomáš
Advisor
Referee
Mark
Journal Title
Journal ISSN
Volume Title
Publisher
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
ORCID
Abstract
This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.
Description
Citation
Proceedings of the 22nd Conference STUDENT EEICT 2016. s. 237-239. ISBN 978-80-214-5350-0
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
Document type
Peer-reviewed
Document version
Published version
Date of access to the full text
Language of document
sk