Substrate Integrated Waveguide Cavity Filters: Miniaturization and New Materials for IoT Applications

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dc.contributor.authorTomassoni, Cristiano
dc.contributor.authorBozzi, Maurizio
dc.coverage.issue3cs
dc.coverage.volume26cs
dc.date.accessioned2017-09-15T08:41:53Z
dc.date.available2017-09-15T08:41:53Z
dc.date.issued2017-09cs
dc.description.abstractThis paper presents an overview of the current research trends in the field of substrate integrated waveguide (SIW) technology, with particular emphasis on the issues related to the emerging applications in the framework of the Internet of Things (IoT) and the fifth generation of mobile communication (5G). More specifically, different techniques adopted to miniaturize SIW cavities are described, with the aim of reducing the footprint of SIW components and filters. Moreover, the use of innovative materials, like paper, textile and 3D printed dielectric substrates, is presented and discussed, and the implementation of ecofriendly, wearable, and fully 3D structures is illustrated.en
dc.formattextcs
dc.format.extent633-641cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationRadioengineering. 2017 vol. 26, č. 3, s. 633-641. ISSN 1210-2512cs
dc.identifier.doi10.13164/re.2017.0633en
dc.identifier.issn1210-2512
dc.identifier.urihttp://hdl.handle.net/11012/69958
dc.language.isoencs
dc.publisherSpolečnost pro radioelektronické inženýrstvícs
dc.relation.ispartofRadioengineeringcs
dc.relation.urihttps://www.radioeng.cz/fulltexts/2017/17_03_0633_0641.pdfcs
dc.rightsCreative Commons Attribution 4.0 Internationalen
dc.rights.accessopenAccessen
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/en
dc.subjectSubstrate integrated waveguide (SIW)en
dc.subjectfiltersen
dc.subjectpaper-based electronicsen
dc.subjectwearable microwave componentsen
dc.subjectadditive manufacturing.en
dc.titleSubstrate Integrated Waveguide Cavity Filters: Miniaturization and New Materials for IoT Applicationsen
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.facultyFakulta eletrotechniky a komunikačních technologiícs
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