Kurz přípravy MEMS – mikro elektro mechanických součástek

dc.contributor.author	Eliáš, Marek
dc.date.accessioned	2024-05-03T11:03:33Z
dc.date.available	2024-05-03T11:03:33Z
dc.date.created	2023-11-30	cs
dc.date.issued	2024-05-03	cs
dc.description.abstract	This course aims to provide an overview of the basic theoretical knowledge in dry etching, which is used to create Micro-Electro-Mechanical Systems (MEMS ). You will learn about the principles of etching, basic terminology, types of plasmas used for etching, differences between dry and wet etching, etc.	en
dc.format	text	cs
dc.format.mimetype	application/pdf	cs
dc.identifier.uri	https://hdl.handle.net/11012/245341
dc.language.iso	cs	cs
dc.publisher	VUT v Brně	cs
dc.relation.projectId	NPO_VUT_MSMT-16609/2022
dc.relation.uri	https://www.vut.cz/vav/projekty/npo	cs
dc.rights	Creative Commons Attribution-ShareAlike 4.0 International	cs
dc.rights.access	openAccess	cs
dc.rights.uri	http://creativecommons.org/licenses/by-sa/4.0/	cs
dc.subject	Dry etching	cs
dc.subject	wet etching	cs
dc.subject	MEMS	cs
dc.subject	reactiv ion etching (RIE)	cs
dc.subject	deep silicon etching (DSE)	cs
dc.title	Kurz přípravy MEMS – mikro elektro mechanických součástek	cs
dc.type.driver	other	en
dc.type.version	publishedVersion	en

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