Analysis of Defects on PCB Using X - Plane Method
| but.event.date | 23.04.2015 | cs |
| but.event.title | Student EEICT 2015 | cs |
| dc.contributor.author | Mlýnek, M. | |
| dc.date.accessioned | 2015-08-25T08:43:00Z | |
| dc.date.available | 2015-08-25T08:43:00Z | |
| dc.date.issued | 2015 | cs |
| dc.description.abstract | Using x – ray is one way for analyzing structural defects on PCB and lead components. X – Plane method is based on making individual 2D slices within a sample from top to bottom, front to back and left to right. There is no need to cut or destroy sample. X – Plane method works at high magnification. Method is showing position and size of voids or cracks, identifying head on pillow, open joint and other defects. | en |
| dc.format | text | cs |
| dc.format.extent | 286-288 | cs |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | Proceedings of the 21st Conference STUDENT EEICT 2015. s. 286-288. ISBN 978-80-214-5148-3 | cs |
| dc.identifier.isbn | 978-80-214-5148-3 | |
| dc.identifier.uri | http://hdl.handle.net/11012/43003 | |
| dc.language.iso | cs | cs |
| dc.publisher | Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií | cs |
| dc.relation.ispartof | Proceedings of the 21st Conference STUDENT EEICT 2015 | en |
| dc.relation.uri | http://www.feec.vutbr.cz/EEICT/ | cs |
| dc.rights | © Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií | cs |
| dc.rights.access | openAccess | en |
| dc.subject | X – plane | en |
| dc.subject | X – ray | en |
| dc.subject | defect | en |
| dc.subject | analysis | en |
| dc.title | Analysis of Defects on PCB Using X - Plane Method | en |
| dc.type.driver | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
| eprints.affiliatedInstitution.department | Fakulta elektrotechniky a komunikačních technologií | cs |