Analysis of Defects on PCB Using X - Plane Method
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Date
Authors
Mlýnek, M.
Advisor
Referee
Mark
Journal Title
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Volume Title
Publisher
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
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Abstract
Using x – ray is one way for analyzing structural defects on PCB and lead components. X – Plane method is based on making individual 2D slices within a sample from top to bottom, front to back and left to right. There is no need to cut or destroy sample. X – Plane method works at high magnification. Method is showing position and size of voids or cracks, identifying head on pillow, open joint and other defects.
Description
Citation
Proceedings of the 21st Conference STUDENT EEICT 2015. s. 286-288. ISBN 978-80-214-5148-3
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
Document type
Peer-reviewed
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Published version
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cs