Design Of Reflow Soldering Station For Reballing Of Bga Packages

Abstract

This article deals with the design of a soldering oven for BGA reballing in a nitrogen atmosphere. The principles of reflow soldering, the advantages of a nitrogen atmosphere regarding the quality of solder joints and the types of soldering devices are described. The main aim of the experimental part is to design the soldering station and to simulate the heat flow during soldering using SolidWorks Flow Simulation. Final stage of this work is based on verification of designed soldering station and optimization of soldering process.