Experimental Teaching of Microelectronics Assembly Technology

Simple item page
dc.contributor.authorSzendiuch, Ivancs
dc.coverage.issue2cs
dc.coverage.volume4cs
dc.date.issued2020-01-19cs
dc.description.abstractThis contribution gives some practical experience about the education program in the microelectronics assembly technology, as part of the base of hardware. It is closed to modern technologies of electronic packaging and interconnection. The subject “Modern Microelectronics Technology” should be a par of the modern educational programs in the area of “Electronics Hardware” in both Bachelor´s and Master´s degree program. The content of the lectures is in accordance with the global development and is co-ordinated with programs at various universities worldwide. A new idea, and at the same time the main objective in this area is to achieve still closer contact of the University with the industry in terms of technological integration. Lectures and laboratory curricula are described, as well as the supporting project, which is implemented in the form of an integrated circuit, by students in team work organization. Practical training in the microelectronics laboratory forms a very important part of the learning process, which is positive valued by students, and was also awarded by the International Microelectronics Assembly and Packaging Society [1]. The laboratory is based on low-cost no-vacuum thick film technology, which allows students to realize various electronics components and also their own integrated circuit. Therefore, the main emphasis is on the acquisition of practical skills and abilities. It also increases students' motivation and their active approach to study. This paper describes the structure of the course and includes also some experience of teaching.en
dc.formattextcs
dc.format.extent263-269cs
dc.format.mimetypeapplication/pdfcs
dc.identifier.citationThe Educational Review. 2020, vol. 4, issue 2, p. 263-269.en
dc.identifier.doi10.26855/er.2020.02.001cs
dc.identifier.issn2575-7946cs
dc.identifier.orcid0000-0002-1738-7817cs
dc.identifier.other162613cs
dc.identifier.scopus7801465114cs
dc.identifier.urihttp://hdl.handle.net/11012/193379
dc.language.isoencs
dc.publisherHill Publiwshingcs
dc.relation.ispartofThe Educational Reviewcs
dc.relation.urihttp://www.hillpublisher.com/ArticleDetails/260cs
dc.rightsCreative Commons Attribution 4.0 Internationalcs
dc.rights.accessopenAccesscs
dc.rights.sherpahttp://www.sherpa.ac.uk/romeo/issn/2575-7946/cs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjecteducationen
dc.subjectexperimental teaching in microelectronics assemgbly technologyen
dc.titleExperimental Teaching of Microelectronics Assembly Technologyen
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
sync.item.dbidVAV-162613en
sync.item.dbtypeVAVen
sync.item.insts2025.02.03 15:40:56en
sync.item.modts2025.01.17 15:27:19en
thesis.grantorVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií. Ústav mikroelektronikycs
Files
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
20200304172834.pdf
Size:
1.49 MB
Format:
Adobe Portable Document Format
Description:
20200304172834.pdf
Download
Collections
Ústav mikroelektroniky