Influence of heat flow direction on solder ball interfacial layer

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dc.contributor.authorOtáhal, Alexandrcs
dc.contributor.authorSzendiuch, Ivancs
dc.coverage.issue4cs
dc.coverage.volume69cs
dc.date.issued2018-09-19cs
dc.description.abstractThis paper deals with the research of an intermetallic layer of SAC305 solder balls soldered from three directions of the heat flow in the ball-attach process for BGA package. From the point of view of the heat flow direction, the samples were soldered by infrared heating. The heat sources were placed on the top, bottom and both lateral sides of the BGA package. After the solder balls-attach process, a metallographic cross-section was performed, followed by selective etching to visualize the relief of the intermetallic layer. Images of the interfacial between the solder and solder pad were taken from the created samples, followed by measurement of the average thickness and root mean square roughness of the intermetallic layer. The results showed changes in the intermetallic layer. The largest thickness of the intermetallic layer was observed on samples soldered from the top and both sides. Soldering with the bottom infrared heater resulted to the smallest thickness of the intermetallic layer. The same trend was in the roughness of the IMC layer. The greatest roughness was found for samples soldered by the top and both side heaters. The top soldered samples exhibit the smallest roughness.en
dc.formattextcs
dc.format.extent305-310cs
dc.format.mimetypeapplication/pdfcs
dc.identifier.citationJournal of Electrical Engineering. 2018, vol. 69, issue 4, p. 305-310.en
dc.identifier.doi10.2478/jee-2018-0043cs
dc.identifier.issn1339-309Xcs
dc.identifier.orcid0000-0001-7553-6940cs
dc.identifier.orcid0000-0002-1738-7817cs
dc.identifier.other150170cs
dc.identifier.scopus7801465114cs
dc.identifier.urihttp://hdl.handle.net/11012/200885
dc.language.isoencs
dc.relation.ispartofJournal of Electrical Engineeringcs
dc.relation.urihttps://www.degruyter.com/view/j/jee.2018.69.issue-4/jee-2018-0043/jee-2018-0043.xmlcs
dc.rightsCreative Commons Attribution-NonCommercial-NoDerivatives 4.0 Internationalcs
dc.rights.accessopenAccesscs
dc.rights.sherpahttp://www.sherpa.ac.uk/romeo/issn/1339-309X/cs
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/cs
dc.subjectBGA packageen
dc.subjectreflow solderingen
dc.subjectinfrared heateren
dc.subjectheat flow directionen
dc.subjectintermetallic interfacial layeren
dc.titleInfluence of heat flow direction on solder ball interfacial layeren
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
sync.item.dbidVAV-150170en
sync.item.dbtypeVAVen
sync.item.insts2025.02.03 15:41:02en
sync.item.modts2025.01.17 18:45:59en
thesis.grantorVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií. Ústav mikroelektronikycs
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