Impact of the SiNx Thickness on Passivation Quality and Contact Resistivity of Silicon Solar Cell
but.event.date | 28.04.2016 | cs |
but.event.title | Student EEICT 2016 | cs |
dc.contributor.author | Mojrová, Barbora | |
dc.date.accessioned | 2018-07-10T12:48:22Z | |
dc.date.available | 2018-07-10T12:48:22Z | |
dc.date.issued | 2016 | cs |
dc.description.abstract | In this work the influence of thickness of Silicon Nitride (SiNX) layer deposited by Plasma Enhanced Chemical Vapour Deposition (PECVD) on passivation quality and contact resistivity (ρC) of n-type Passivated Emitter Rear Totally-diffused (n-PERT) cell was investigated. The solar cell structure comprises front boron emitter and a phosphorous back surface field (BSF) with SiNX layers on both sides for surface passivation. Contacts are made by screen printed and fired through metallization using commercial silver (Ag) paste. | en |
dc.format | text | cs |
dc.format.extent | 690-694 | cs |
dc.format.mimetype | application/pdf | en |
dc.identifier.citation | Proceedings of the 22nd Conference STUDENT EEICT 2016. s. 690-694. ISBN 978-80-214-5350-0 | cs |
dc.identifier.isbn | 978-80-214-5350-0 | |
dc.identifier.uri | http://hdl.handle.net/11012/84021 | |
dc.language.iso | en | cs |
dc.publisher | Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií | cs |
dc.relation.ispartof | Proceedings of the 22nd Conference STUDENT EEICT 2016 | en |
dc.relation.uri | http://www.feec.vutbr.cz/EEICT/ | cs |
dc.rights | © Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií | cs |
dc.rights.access | openAccess | en |
dc.subject | silicon solar cell | en |
dc.subject | n-type | en |
dc.subject | n-PERT | en |
dc.subject | SiNX | en |
dc.subject | passivation | en |
dc.subject | contact resistivity | en |
dc.title | Impact of the SiNx Thickness on Passivation Quality and Contact Resistivity of Silicon Solar Cell | en |
dc.type.driver | conferenceObject | en |
dc.type.status | Peer-reviewed | en |
dc.type.version | publishedVersion | en |
eprints.affiliatedInstitution.department | Fakulta elektrotechniky a komunikačních technologií | cs |
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