Characterization of Four-Layer Microwave Magnetic Probe Design for Integrated Circuit Emission Measurement

Abstract

With the increase of microwave circuit and system integration design density, the test method to assess the electromagnetic compatibility (EMC) undesirable effect remains a challenging task. To tackle this issue for example with radiated emission analysis, a relevant EMC measurement notably for integrated circuits (IC) and printed circuit board (PCB) is necessary. A four-layer magnetic (H) near-field (NF) probe in miniature technology is designed, fabricated and tested. The H-NF probe works in the challenging frequency band up to 20 GHz. The proposed probe has the advantages of miniaturization, high sensitivity, high flatness, and high electric field suppression. The designed and fabricated H-NF probe characterization is validated with respect to IEC-61967 EMC standard. The device under test (DUT) IC radiation was tested and characterized. Experimental results have shown that the H-NF probe can be used for measuring IC EMC radiation emission.