State-of-the-Art Electronic Materials for Thin Films in Bioelectronics

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dc.contributor.authorGablech, Imrichcs
dc.contributor.authorGlowacki, Eric Danielcs
dc.coverage.issue8cs
dc.coverage.volume9cs
dc.date.issued2023-08-01cs
dc.description.abstractThis review is dedicated to electronics materials enabling thin-film-based neural interface and bioelectronics devices. First-generation bioelectronic medicine devices feature hand-crafted bulk interface electrodes, wires and interconnects, and insulators. This review discusses how modern materials science, especially know-how repurposed from semiconductor and microdevice technologies, enables next-generation bioelectronics. Those are divided into two subgroups: second and third generation. The former refers to rigid microscaled devices, while the latter is defined as soft, ultrathin, and flexible microdevices. A critical assessment of different biointerface electrodes, conductors for interconnects, and insulators for substrates, passivation, and encapsulation layers is made. The goal is not to give an exhaustive account of every use-example of given materials, but to point out specific aspects that are relevant to making the right choices for materials for a given device or application. Unique advantages of specific materials are highlighted, while also focusing on weaker points and caveats that those materials may have. The goal is to have an up-to-date handbook for persons entering the field which also points out tips and tricks as well as challenging problems that researchers can be inspired to confront and overcome.en
dc.formattextcs
dc.format.extent1-23cs
dc.format.mimetypeapplication/pdfcs
dc.identifier.citationAdvanced Electronic Materials. 2023, vol. 9, issue 8, p. 1-23.en
dc.identifier.doi10.1002/aelm.202300258cs
dc.identifier.issn2199-160Xcs
dc.identifier.orcid0000-0003-4218-1287cs
dc.identifier.orcid0000-0002-0280-8017cs
dc.identifier.other184675cs
dc.identifier.researcheridH-7835-2016cs
dc.identifier.scopus55091127400cs
dc.identifier.urihttp://hdl.handle.net/11012/244283
dc.language.isoencs
dc.publisherWileycs
dc.relation.ispartofAdvanced Electronic Materialscs
dc.relation.urihttps://onlinelibrary.wiley.com/doi/10.1002/aelm.202300258cs
dc.rightsCreative Commons Attribution 4.0 Internationalcs
dc.rights.accessopenAccesscs
dc.rights.sherpahttp://www.sherpa.ac.uk/romeo/issn/2199-160X/cs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjectbioelectronicsen
dc.subjectbiomedical engineeringen
dc.subjectencapsulationen
dc.subjectfunctional materialsen
dc.subjectthin filmsen
dc.titleState-of-the-Art Electronic Materials for Thin Films in Bioelectronicsen
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
sync.item.dbidVAV-184675en
sync.item.dbtypeVAVen
sync.item.insts2025.02.03 15:41:15en
sync.item.modts2025.01.17 15:28:04en
thesis.grantorVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií. Ústav mikroelektronikycs
thesis.grantorVysoké učení technické v Brně. Středoevropský technologický institut VUT. Bioelektronické materiály a systémycs
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