Thermomechanical simulation of modern electronic packages
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Date
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Skácel, J.
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Referee
Mark
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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
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Abstract
This paper deals with issue of modern electronic packages mainly thermo-mechanical simulation. The first part is focused on the comparing of QFN (Quad-Flat No leads) and BGA (Ball Grid Array) packages including their advantages and disadvantages. The second part is focused on simulation of these packages in ANSYS program from the point of thermos-mechanical behavior.
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Proceedings of the 21st Conference STUDENT EEICT 2015. s. 289-291. ISBN 978-80-214-5148-3
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
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Peer-reviewed
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cs