Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method

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dc.contributor.authorKarimi-Sibaki, Ebrahimcs
dc.contributor.authorVakhrushev, Alexandercs
dc.contributor.authorWu, Menghuaics
dc.contributor.authorLudwig, Andreascs
dc.contributor.authorBoháček, Jancs
dc.contributor.authorKharicha, Abdellahcs
dc.coverage.issue7cs
dc.coverage.volume170cs
dc.date.accessioned2024-02-16T09:45:35Z
dc.date.available2024-02-16T09:45:35Z
dc.date.issued2023-07-04cs
dc.description.abstractA numerical model utilizing the volume of fluid (VOF) method is proposed to simulate the transient shape changes of the deposit front, considering the diffusion-limited electrodeposition process. Modeling equations are proposed to accurately handle transport phenomena in both electrolyte (fluid) and deposit (solid). Transient evolutions of field structures, including flow, concentration, electric current density, and electric potential, are computed considering electrodeposited copper bumps. Two cases, including single cavity and multiple cavities, are studied. Based on the modeling results, the maximum height of the hump and the thickness of the deposited layer in each consecutive cavity decreases going from upstream to downstream. Conversely, the location of the maximum height of the hump remains unchanged in all cavities. Results are validated against available experiments.en
dc.formattextcs
dc.format.extent1-6cs
dc.format.mimetypeapplication/pdfcs
dc.identifier.citationJOURNAL OF THE ELECTROCHEMICAL SOCIETY. 2023, vol. 170, issue 7, p. 1-6.en
dc.identifier.doi10.1149/1945-7111/ace133cs
dc.identifier.issn0013-4651cs
dc.identifier.orcid0000-0003-3319-4254cs
dc.identifier.other184760cs
dc.identifier.researcheridC-2078-2018cs
dc.identifier.scopus55213548700cs
dc.identifier.urihttps://hdl.handle.net/11012/244991
dc.language.isoencs
dc.publisherELECTROCHEMICAL SOC INCcs
dc.relation.ispartofJOURNAL OF THE ELECTROCHEMICAL SOCIETYcs
dc.relation.urihttps://iopscience.iop.org/article/10.1149/1945-7111/ace133cs
dc.rightsCreative Commons Attribution 4.0 Internationalcs
dc.rights.accessopenAccesscs
dc.rights.sherpahttp://www.sherpa.ac.uk/romeo/issn/0013-4651/cs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjectSHAPE EVOLUTIONen
dc.subjectCOPPERen
dc.subjectDEPOSITIONen
dc.subjectBUMPSen
dc.subjectMODELen
dc.titleTransient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Methoden
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
sync.item.dbidVAV-184760en
sync.item.dbtypeVAVen
sync.item.insts2024.02.16 10:45:35en
sync.item.modts2024.02.16 10:13:27en
thesis.grantorVysoké učení technické v Brně. Fakulta strojního inženýrství. Laboratoř přenosu tepla a prouděnícs
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