The Technology Of Ceramic Packages

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but.event.date27.04.2017cs
but.event.titleStudent EEICT 2017cs
dc.contributor.authorSkácel, Josef
dc.date.accessioned2020-05-07T09:40:32Z
dc.date.available2020-05-07T09:40:32Z
dc.date.issued2017cs
dc.description.abstractThis paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.en
dc.formattextcs
dc.format.extent542-546cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationProceedings of the 23st Conference STUDENT EEICT 2017. s. 542-546. ISBN 978-80-214-5496-5cs
dc.identifier.isbn978-80-214-5496-5
dc.identifier.urihttp://hdl.handle.net/11012/187162
dc.language.isoencs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 23st Conference STUDENT EEICT 2017en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.rights.accessopenAccessen
dc.subjectceramicen
dc.subjectpackagingen
dc.subjectsinteringen
dc.subjectsimulationen
dc.titleThe Technology Of Ceramic Packagesen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
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