Effects Affecting BGA Soldering
| but.event.date | 23.04.2015 | cs |
| but.event.title | Student EEICT 2015 | cs |
| dc.contributor.author | Janíček, M. | |
| dc.date.accessioned | 2015-08-25T08:43:00Z | |
| dc.date.available | 2015-08-25T08:43:00Z | |
| dc.date.issued | 2015 | cs |
| dc.description.abstract | This paper deals with effects, which can affect solder joints quality. It also evaluates experiments which were made. These experiments were connected with fluxes problematic. First there are mentioned effects connected with amount of flux, and then experiments were focused to ways of applying the flux. Next steps are mentioned at the end of the paper. | en |
| dc.format | text | cs |
| dc.format.extent | 274-276 | cs |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | Proceedings of the 21st Conference STUDENT EEICT 2015. s. 274-276. ISBN 978-80-214-5148-3 | cs |
| dc.identifier.isbn | 978-80-214-5148-3 | |
| dc.identifier.uri | http://hdl.handle.net/11012/42999 | |
| dc.language.iso | cs | cs |
| dc.publisher | Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií | cs |
| dc.relation.ispartof | Proceedings of the 21st Conference STUDENT EEICT 2015 | en |
| dc.relation.uri | http://www.feec.vutbr.cz/EEICT/ | cs |
| dc.rights | © Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií | cs |
| dc.rights.access | openAccess | en |
| dc.subject | BGA | en |
| dc.subject | flux | en |
| dc.subject | repair | en |
| dc.subject | IR soldering | en |
| dc.title | Effects Affecting BGA Soldering | en |
| dc.type.driver | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
| eprints.affiliatedInstitution.department | Fakulta elektrotechniky a komunikačních technologií | cs |