Effect of wood chips properties on mineralogical composition and microstructure of silicate matrix based composites

Loading...
Thumbnail Image

Authors

Melichar, Tomáš
Bydžovský, Jiří
Dufka, Amos

Advisor

Referee

Mark

Journal Title

Journal ISSN

Volume Title

Publisher

IOP Publishing
Altmetrics

Abstract

The research presented in this article was focused on proving the effect of wood chips parameters on the hardening process of silicate matrix in cement-bonded particleboard. Namely content of humidity in the chips (in range 30 to 90%) was significant. This amount of humidity was chosen with respect to real conditions of cement-bonded particleboards production. Influence of humidity could be reflected in the content of sugar (cellulose etc.) in wooden chips. The sugars affect the hardening of matrix negatively. Thus, phase composition and microstructure of matrix of cement-bonded particle boards were analysed during 2 to 28 days. Investigation of physico-chemical parameters and microstructure was also supplemented by verification of the basic material characteristics of cement-bonded particleboards (strength and modulus of elasticity in bending, transverse tensile strength perpendicular to the plane of the board, etc.).
The research presented in this article was focused on proving the effect of wood chips parameters on the hardening process of silicate matrix in cement-bonded particleboard. Namely content of humidity in the chips (in range 30 to 90%) was significant. This amount of humidity was chosen with respect to real conditions of cement-bonded particleboards production. Influence of humidity could be reflected in the content of sugar (cellulose etc.) in wooden chips. The sugars affect the hardening of matrix negatively. Thus, phase composition and microstructure of matrix of cement-bonded particle boards were analysed during 2 to 28 days. Investigation of physico-chemical parameters and microstructure was also supplemented by verification of the basic material characteristics of cement-bonded particleboards (strength and modulus of elasticity in bending, transverse tensile strength perpendicular to the plane of the board, etc.).

Description

Citation

IOP Conference Series: Materials Science and Engineering. 2018, vol. 385, issue 1, p. 1-6.
http://iopscience.iop.org/article/10.1088/1757-899X/385/1/012035

Document type

Peer-reviewed

Document version

Published version

Date of access to the full text

Language of document

en

Study field

Comittee

Date of acceptance

Defence

Result of defence

Endorsement

Review

Supplemented By

Referenced By

Creative Commons license

Except where otherwised noted, this item's license is described as Creative Commons Attribution 3.0 Unported
Citace PRO