Short Distance Thermal Camera For Overheat Detection

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Radvanský, Martin

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Mark

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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

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Abstract

During the development or repairing of electronic devices, we often meet problems with overheated components on the printed circuit board. For identification of overheating components, we usually use a thermal camera. The main aim of this project is to develop an inexpensive thermal camera for hobby usage.

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Proceedings of the 25st Conference STUDENT EEICT 2019. s. 102-104. ISBN 978-80-214-5735-5
http://www.feec.vutbr.cz/EEICT/

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cs

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