Simulation of Heat Transfer in Low-Voltage Switchboard MNS

Loading...
Thumbnail Image

Date

Authors

Czudek, A.

Advisor

Referee

Mark

Journal Title

Journal ISSN

Volume Title

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

ORCID

Abstract

The content of this work is the diagnosis of the temperature profile of industrial low voltage switchboards. Place of origin, flow and heat dissipation are important aspects in the design of the cabinet, particularly with regard to the layout of your devices. The correctness of the design cabinet can be verified by measuring the temperature field practical cabinet during testing or in work mode. Another option is to simulate the temperature profile of the low voltage. This can prevent waste of materials and saving money for the development

Description

Citation

Proceedings of the 21st Conference STUDENT EEICT 2015. s. 268-270. ISBN 978-80-214-5148-3
http://www.feec.vutbr.cz/EEICT/

Document type

Peer-reviewed

Document version

Published version

Date of access to the full text

Language of document

cs

Study field

Comittee

Date of acceptance

Defence

Result of defence

DOI

Endorsement

Review

Supplemented By

Referenced By

Citace PRO