Thermal Resistance of Bonded Facade Joints

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Authors

Liška, Pavel
Šlanhof, Jiří
Nečasová, Barbora

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Mark

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EDIS - Publishing Institution of the University of Zilina

Abstract

Mechanical joints are the most frequently used option in the construction of vented facades. However, bonded joints are becoming a viable and accessible alternative. This article deals with the issues connected with testing the most critical elements in the whole system – bonded joints – from the point of view of exposure to high temperatures. For these purposes, "Cetris" cement-bonded particleboard was selected for use as cladding material, and a substructure made from aluminium alloy was chosen. Five types of adhesive were selected in order to find the most suitable bonding material. During the testing procedures, the suitability of selected adhesives for the chosen combination of materials was tested, as was the assumption that the use of the most expensive sealant does not always provide the best results.
Mechanical joints are the most frequently used option in the construction of vented facades. However, bonded joints are becoming a viable and accessible alternative. This article deals with the issues connected with testing the most critical elements in the whole system – bonded joints – from the point of view of exposure to high temperatures. For these purposes, "Cetris" cement-bonded particleboard was selected for use as cladding material, and a substructure made from aluminium alloy was chosen. Five types of adhesive were selected in order to find the most suitable bonding material. During the testing procedures, the suitability of selected adhesives for the chosen combination of materials was tested, as was the assumption that the use of the most expensive sealant does not always provide the best results.

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ARSA - Proceedings in ARSA - Advanced Research in Scientific Areas. 2014, vol. 3, issue 1, p. 314-317.
http://arsa-conf.com/archive/?vid=1&aid=2&kid=60301-30

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Peer-reviewed

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en

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Except where otherwised noted, this item's license is described as Creative Commons Attribution-NonCommercial 4.0 International
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