Current and Future Research Trends in Substrate Integrated Waveguide Technology

Abstract

Substrate Integrated Waveguide (SIW) technology is the most promising candidate for the implementation of millimeter-wave (mm-wave) integrated circuits and systems for the next decade. Based on planar dielectric substrates with top and bottom metal layers perforated with metalized holes, SIW structures offer a compact, low loss, flexible, and cost-effective solution for integrating active circuits, passive components and radiating elements on the same substrate. This paper presents an overview of the current status and future trends of academic and industrial research on SIW technology. The historical development of SIW components and circuits is briefly outlined, and the current research topics are discussed: they include the development of numerical techniques for the modeling and design of SIW components, the investigation of novel compact and broadband interconnects, the determination of design solutions for loss minimization. Future research trends are also discussed: they mainly aim at the implementation of SIW components at higher frequency (60-350 GHz) and the integration of complete Systems-on-Substrate (SoS).