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\contentsline {chapter}{Úvod}{13}{section*.7}%
\contentsline {section}{\numberline {0.1}Ciele práce}{13}{section.8}%
\contentsline {chapter}{\numberline {1}Teoretická čast študentskej práce}{14}{chapter.9}%
\contentsline {subsection}{\numberline {1.0.1}Základná koncepcia konštrukcie\cite {sem}}{14}{subsection.10}%
\contentsline {section}{\numberline {1.1}Štruktúra testovacej úlohy \cite {sem}}{14}{section.12}%
\contentsline {section}{\numberline {1.2}Periférie a rozhrania kitu \cite {sem}}{15}{section.13}%
\contentsline {subsection}{\numberline {1.2.1}ATmega328P Xplained mini}{16}{subsection.14}%
\contentsline {subsection}{\numberline {1.2.2}LCD keypad shield 1602A}{16}{subsection.16}%
\contentsline {subsection}{\numberline {1.2.3}Zariadenia pripájané cez GPIO}{17}{subsection.17}%
\contentsline {subsubsection}{Maticová klávesnica}{17}{section*.18}%
\contentsline {subsubsection}{Enkodér s tlačidlom}{18}{section*.20}%
\contentsline {subsubsection}{Relé modul}{18}{section*.21}%
\contentsline {subsection}{\numberline {1.2.4}Zariadenia s I2C zbernicou}{19}{subsection.22}%
\contentsline {section}{\numberline {1.3}Možné problémy a ich riešenia pri návrhu \cite {sem}}{19}{section.23}%
\contentsline {subsection}{\numberline {1.3.1}Prevody napäťových úrovní analógových}{19}{subsection.24}%
\contentsline {subsubsection}{Pasívny napäťový delič}{19}{section*.25}%
\contentsline {subsubsection}{Aktívny napäťový delič}{20}{section*.26}%
\contentsline {subsubsection}{Neinvertujúci zosilňovač}{20}{section*.28}%
\contentsline {subsubsection}{Externý Analógovo digitálny prevodník}{21}{section*.30}%
\contentsline {subsubsection}{Externý Digitálne analógový prevodník}{21}{section*.31}%
\contentsline {subsection}{\numberline {1.3.2}Prevody napäťových úrovní digitálnych}{22}{subsection.32}%
\contentsline {subsubsection}{zapojenie s otvoreným kolektorom a open drain circuit}{22}{section*.33}%
\contentsline {subsubsection}{Obojstranné zapojenie s unipolárnym tranzistorom}{22}{section*.35}%
\contentsline {subsubsection}{Jednosmerné prevodníky digitálnych napäťových úrovní}{23}{section*.37}%
\contentsline {subsubsection}{Obojsmerné prevodníky digitálnych napäťových úrovní}{23}{section*.38}%
\contentsline {subsubsection}{GPIO expandér}{24}{section*.40}%
\contentsline {subsection}{\numberline {1.3.3}Zdieľanie vstupov}{25}{subsection.41}%
\contentsline {subsubsection}{Multiplexer}{25}{section*.42}%
\contentsline {subsubsection}{dekodér}{25}{section*.43}%
\contentsline {subsubsection}{Integrovaný spínač}{25}{section*.44}%
\contentsline {subsection}{\numberline {1.3.4}Získavanie a stabilizácia napájacích napätí}{27}{subsection.47}%
\contentsline {subsubsection}{LDO regulátory}{27}{section*.48}%
\contentsline {subsubsection}{Spínacie regulátory}{27}{section*.50}%
\contentsline {subsection}{\numberline {1.3.5}Vedenie dráh plošného spoja}{27}{subsection.52}%
\contentsline {subsubsection}{Diferenciálne vedenia}{29}{section*.58}%
\contentsline {subsection}{\numberline {1.3.6}Ochrana pred ESD}{30}{subsection.61}%
\contentsline {section}{\numberline {1.4}Softvérová architektúra}{33}{section.64}%
\contentsline {subsection}{\numberline {1.4.1}Sprostredkovanie udalostí}{34}{subsection.66}%
\contentsline {subsection}{\numberline {1.4.2}Realizácia testov pomocou Lua}{35}{subsection.67}%
\contentsline {subsection}{\numberline {1.4.3}Jazyk implementovaný na mieru}{38}{subsection.70}%
\contentsline {subsection}{\numberline {1.4.4}Výsledná architektúra spomenutých riešení}{40}{subsection.71}%
\contentsline {subsubsection}{COM rozhranie PC - jadro}{41}{section*.73}%
\contentsline {chapter}{\numberline {2}Výsledky študentskej práce}{43}{chapter.75}%
\contentsline {section}{\numberline {2.1}Návrh dosky plošného spoja modulu prípravku \cite {sem}}{43}{section.76}%
\contentsline {subsubsection}{Zásuvka pre riadiaci modul}{44}{section*.87}%
\contentsline {subsubsection}{Prevodník napätí i2c a uart rozhraní}{44}{section*.88}%
\contentsline {subsubsection}{Zásuvka pre LCD modul a testovaný kit}{44}{section*.89}%
\contentsline {subsubsection}{Prevodník digitálnych napäťových úrovní}{44}{section*.90}%
\contentsline {subsubsection}{Digitálno-analógový prevodník}{45}{section*.91}%
\contentsline {subsubsection}{Prevodník rozsahu signálu tlačidiel LCD modulu}{45}{section*.92}%
\contentsline {subsubsection}{Časť pripájania i2c modulu , enkodéru a modulu s teplomerom}{45}{section*.93}%
\contentsline {subsubsection}{Dekodér obsluhujúci maticovú klávesnicu a LED indikátory.}{45}{section*.94}%
\contentsline {subsubsection}{Časť pripájania relé modulu}{45}{section*.95}%
\contentsline {section}{\numberline {2.2}Návrh dosky plošného spoja modulu systémového jadra \cite {sem}}{46}{section.96}%
\contentsline {subsection}{\numberline {2.2.1}Napájacie napätie}{46}{subsection.97}%
\contentsline {subsection}{\numberline {2.2.2}Vedenie USB rozhrania}{47}{subsection.100}%
\contentsline {section}{\numberline {2.3}Procedúry testov HW modulov}{48}{section.103}%
\contentsline {subsubsection}{Relé modul}{48}{section*.104}%
\contentsline {subsubsection}{LCD modul}{49}{section*.112}%
\contentsline {subsubsection}{Maticová klávesnica}{49}{section*.120}%
\contentsline {subsubsection}{Enkodér}{49}{section*.123}%
\contentsline {subsubsection}{Teplomer}{50}{section*.127}%
\contentsline {subsubsection}{I2C modul}{50}{section*.131}%
\contentsline {section}{\numberline {2.4}Problémy navrhnutej DPS}{50}{section.140}%
\contentsline {section}{\numberline {2.5}Migrácie na iné jadro}{52}{section.142}%
\contentsline {subsection}{\numberline {2.5.1}Konverzie pre podporu 5 V jadra}{52}{subsection.143}%
\contentsline {section}{\numberline {2.6}SW architektúra}{53}{section.152}%
\contentsline {chapter}{Závěr}{61}{section*.155}%
\contentsline {chapter}{Bibliography}{62}{section*.157}%
\contentsline {chapter}{Symbols and abbreviations}{63}{section*.159}%
\contentsline {chapter}{List of appendices}{64}{section*.161}%
\contentsline {chapter}{\numberline {A}Obsah elektronické přílohy }{65}{chapter.162}%
